| IEC Releases Thin Film Standard |
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IEC 62047-12:2011 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This standard applies to vibrating structures ranging in size from 10 μm to 1 000 μm in the plane direction and from 1 μm to 100 μm in thickness, and test materials measuring under 1 mm in length, under 1 mm in width, and between 0,1 μm and 10 μm in thickness. The main structural materials for MEMS, micromachine, etc. have special features, such as typical dimensions of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanical machining, including photolithography. The MEMS structures often have higher fundamental resonant frequency and higher strength than macro structures. To evaluate and assure the lifetime of MEMS structures, a fatigue testing method with ultra high cycles (up to 1012) loadings needs to be established. The object of the test method is to evaluate the mechanical fatigue properties of microscale materials in a short time by applying high load and high cyclic frequency bending stress using resonant vibration. |
Application Note: Pulse Amplifiers and Definitions for EMC Testing Applications!
Application Note: Pulse Amplifiers and Definitions for EMC Testing Applications
IFI’s Pulse TWTA’s provide outstanding pulse fidelity and superior performance for all our customers’ applications. This free document highlights the particular specifications associated with pulse TWTAs. We have also highlighted the standard delineated features incorporated into our amplifier that may be of interest with regard to your system application for this equipment.
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